UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA · West Campus · Hefei · AnhuiUSTC International College
Schools / USTC WEST CAMPUS

School of Microelectronics

Focus areas include integrated circuits, intelligent chips and micro/nano-electronic systems.

Scientists collaborating at laboratory microscopes

At a glance

School of Microelectronics

  • Focus areas include integrated circuits, intelligent chips and micro/nano-electronic systems.

  • The Dian San Building is among the West Campus facilities associated with this field.

Disciplinary identity and research

School of Microelectronics | Disciplinary identity and research

Microelectronics concerns the physical and computational design of integrated electronic systems. Device-level research studies materials and semiconductor processes; chip design examines circuits, architecture and verification; intelligent-chip development connects hardware with computation. Reliable integrated circuits require attention to process variability, yield and energy consumption. USTC research in this area spans both fabrication-oriented challenges and information-processing applications.

Chips, devices and intelligent manufacturing

Integrated-circuit research spans device processes, circuit design and intelligent chip systems. A semiconductor process can vary from wafer to wafer, so yield optimization becomes an engineering and analytical problem, not simply a fabrication task.

Associate Professor Zhang Sihai’s research connects intelligent communication and machine learning to such process optimization, illustrating links between information theory and the engineering of electronic devices.

A closer look at School of Microelectronics

Microelectronics links semiconductor devices with circuit design and system integration. Research questions range from transistor behavior and fabrication constraints to power, performance and reliability. The field overlaps with intelligent sensing, communications and machine learning hardware, placing materials and electronic architecture in a common engineering context.

As circuits become more complex, reliability and thermal performance become part of architectural design rather than concerns left until manufacturing. Device-level and system-level considerations must be addressed together.

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